Molex Acquires Teramount to Accelerate Scalable Co-Packaged Optics

Teramount's detachable fiber-to-chip connectivity solutions will enhance Molex's optical portfolio for AI, cloud, and 5G applications.

Apr. 15, 2026 at 1:06pm

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A highly detailed, glowing 3D macro illustration of a futuristic fiber-optic cable interface with neon cyan and magenta lights, conceptually representing the advanced connectivity technology at the heart of Molex's acquisition of Teramount.Molex's acquisition of Teramount's detachable fiber-to-chip connectivity solutions aims to accelerate the adoption of scalable, energy-efficient Co-Packaged Optics for the next generation of AI, cloud, and 5G infrastructure.Lisle Today

Molex, a global electronics leader, has announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications. Teramount's TeraVERSE® platform provides a pragmatic, field-serviceable interface between optical fiber and silicon photonics chips, enabling faster data rates and reduced power and cooling demands in hyperscale data centers.

Why it matters

The acquisition combines Teramount's innovative fiber-to-chip coupling technology with Molex's global scale, manufacturing expertise, and systems-level know-how, creating a pathway for scalable, high-density CPO adoption. This is crucial for supporting the growing demands of AI, cloud computing, and 5G workloads, which require faster data transfer rates and more energy-efficient solutions.

The details

Teramount's passive, detachable coupling approach supports large assembly tolerances and semiconductor-grade wafer-level processes, making it more scalable than active alignment methods as CPO moves toward volume production. Molex will integrate Teramount's IP and engineering talent with its own optical capabilities and global manufacturing scale to deliver industry-leading performance specifications and accelerate the production of TeraVERSE.

  • The acquisition is expected to close in the first half of 2026, subject to regulatory approvals and other customary closing conditions.
  • Teramount's TeraVERSE platform was recently announced as part of the Molex one-stop CPO solution at OFC 2026.

The players

Molex

A global electronics leader and connectivity innovator committed to making the world a better, more-connected place. Molex enables transformative technology innovation in various industries, including consumer devices, aerospace, data centers, telecommunications, and healthcare.

Teramount Ltd.

An Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications. Teramount's TeraVERSE® platform provides a pragmatic, field-serviceable interface between optical fiber and silicon photonics chips.

Aldo Lopez

President of Datacom Solutions at Molex.

Hesham Taha

CEO and co-founder of Teramount.

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What they’re saying

“Teramount's TeraVERSE technology fills a crucial gap in the CPO stack, offering an advantaged and strategic complement to our optical solutions portfolio. With a practical, detachable fiber-to-chip interface we are afforded a foundational element to realize mainstream CPO adoption.”

— Aldo Lopez, President, Datacom Solutions, Molex

“Harnessing Molex's global scale and system-level expertise with Teramount's innovation expertise and detachable, wafer-level coupling technology creates a real pathway for scalable, high-density CPO.”

— Hesham Taha, CEO and co-founder, Teramount

What’s next

The acquisition is expected to close in the first half of 2026, subject to regulatory approvals and other customary closing conditions.

The takeaway

This acquisition positions Molex as a leader in the rapidly growing Co-Packaged Optics market, enabling it to deliver innovative, scalable solutions that address the increasing demands for faster data transfer rates and energy-efficient connectivity in AI, cloud computing, and 5G applications.