New Method Reveals Hidden Defects in Ultrathin Electronics

Researchers at Rice University develop a way to detect hard-to-spot flaws in a key 2D material used in advanced devices.

Published on Feb. 27, 2026

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Researchers at Rice University have shown that hard-to-spot defects in a widely used two-dimensional insulator called hexagonal boron nitride (hBN) can trap electrical charges and locally weaken the material, making it more likely to fail at lower voltages. By combining electron microscopy, cathodoluminescence mapping, and force-based measurements, the team developed a practical way to spot these hidden defects before they undermine a device.

Why it matters

As future devices continue to push the boundaries of miniaturization, even the tiniest flaws in the materials used can have a big impact on performance and reliability. Identifying these hard-to-detect defects in hBN, a key building block for ultrathin electronics, will help make future devices more reliable and repeatable.

The details

The researchers found that the routine process of peeling thin hBN flakes from a bulk crystal and transferring them onto silicon and silicon dioxide wafers can cause long, narrow misalignments called stacking faults. While these defects look smooth and pristine under regular optical or atomic force microscopes, using cathodoluminescence spectroscopy revealed bright, narrow stacking faults that had been overlooked. These hidden defects act like tiny charge pockets and weaken the insulation properties of hBN, causing the same material to start leaking electricity at much lower voltages along the defect lines compared to nearby areas.

  • The research was published in the journal Nano Letters on February 26, 2026.

The players

Hae Yeon Lee

An assistant professor of materials science and nanoengineering at Rice University and a corresponding author on the study.

Rice University

A private research university located in Houston, Texas, where the research was conducted.

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What they’re saying

“By showing practical ways to detect when and where these defects form, we help make future devices more reliable and repeatable.”

— Hae Yeon Lee, Assistant Professor of Materials Science and Nanoengineering (Mirage News)

What’s next

The researchers plan to further study how these defects form and impact the performance of devices made with hBN and other 2D materials.

The takeaway

This research highlights the importance of identifying even the smallest defects in the materials used for advanced electronics, as they can have an outsized impact on device performance and reliability. The new method developed at Rice University provides a practical way to detect these hard-to-spot flaws in a key 2D material, helping to pave the way for more robust and dependable future devices.