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Beaverton Today
By the People, for the People
Nanoverse Technologies Releases New Advanced Packaging Laser Systems
The company's latest tools offer integrated metrology, high-speed laser scribing, and customizable singulation options.
Mar. 20, 2026 at 4:41am
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Nanoverse Technologies, Limited (NVT) has announced the release of its new Advanced Packaging line of laser systems, including the flagship NVT 7700 model that integrates laser scribing with advanced metrology. The company claims these tools offer the highest die break strength laser process in the industry, with up to 30 wafers per hour processed and placement accuracy under 3 microns. NVT also unveiled the NVT 6600 and NVT 5500 product families, targeting production environments and standalone metrology needs, respectively. The upcoming NVT 9900 platform will feature dual laser configurations for high-speed and high-quality full-cut laser scribing and dicing.
Why it matters
Nanoverse's new laser systems represent an advancement in back-end semiconductor processing technology, providing integrated metrology, high-throughput laser scribing, and customizable singulation options. These capabilities could help semiconductor manufacturers improve die yield, quality, and production efficiency as they work to meet growing demand for advanced packaging.
The details
The NVT 7700 flagship model combines laser scribing with advanced metrology, delivering the highest die break strength laser process in the industry at 2-3x higher than current processes. It can process up to 30 wafers per hour with under 3 micron placement accuracy and a GR&R of less than 300 nm. The system includes modules for independent and simultaneous scribing, dicing, metrology, coating, cleaning, and post-coat baking. The NVT 6600 family targets production environments without integrated metrology but retains the same core capabilities. The NVT 5500 is a standalone metrology and inspection system using a patented phase-based, white light approach for high-speed, high-resolution wafer scanning. The upcoming NVT 9900 will feature dual laser configurations for advanced laser singulation.
- The NVT 7700, NVT 6600, and NVT 5500 are available now.
- The NVT 9900 is set for release in mid-2026.
The players
Nanoverse Technologies Limited (NVT)
A technology company that has developed advanced laser systems for semiconductor packaging and metrology applications.
Jeff Albelo
The CEO of Nanoverse Technologies Limited.
What they’re saying
“We now offer real-time process observability coupled with advanced singulation technology for both rapid prototyping and High-Volume Manufacturing (HVM) alike. It's a game changer.”
— Jeff Albelo, CEO
What’s next
The NVT 9900 platform, featuring dual laser configurations for advanced laser singulation, is set for release in mid-2026.
The takeaway
Nanoverse's new laser systems represent a significant advancement in semiconductor back-end processing, providing integrated metrology, high-throughput laser scribing, and customizable singulation options. These capabilities could help manufacturers improve die yield, quality, and production efficiency as they work to meet growing demand for advanced packaging.
