Nanoverse Technologies Releases Advanced Packaging Laser Systems

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Nanoverse Technologies Limited (NVT) has announced the release of its new Advanced Packaging line of laser systems, including the flagship NVT 7700 which integrates laser scribing with advanced metrology. The systems offer the industry's highest die break strength laser process, high-speed wafer processing, and precise placement accuracy, along with other advanced capabilities for back-end semiconductor packaging.

Why it matters

NVT's new laser systems represent a significant advancement in back-end semiconductor processing technology, providing integrated metrology and laser scribing capabilities that enable greater process control and efficiency for high-volume manufacturing. The systems' performance improvements could help semiconductor companies boost productivity and yield in their advanced packaging operations.

The details

The NVT 7700 flagship model features a laser scribing and dicing module with an ultrafast process capable of on-the-fly power adjustments, delivering the highest die break strength laser process in the industry (2-3x higher than current processes). It can process up to 30 wafers per hour with under 3 micron placement accuracy and a gauge repeatability and reproducibility (GR&R) of less than 300 nm. The system includes multiple modules for independent and simultaneous execution of scribing, dicing, metrology, coating, cleaning, and post-coat baking of both mounted and unmounted wafers in mixed lot processing.

• The NVT 7700 and other Advanced Packaging systems are available now.
• The NVT 9900 platform, representing the next generation of laser-based singulation, is set for release in mid-2026.

What they’re saying

What’s next

The NVT 9900 platform, representing the next generation of laser-based singulation, is set for release in mid-2026.