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Nanoverse Unveils Advanced Packaging Laser Tools
New laser systems offer integrated metrology and singulation capabilities for semiconductor manufacturing
Published on Mar. 5, 2026
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Nanoverse Technologies Limited (NVT) has announced the release of its new Advanced Packaging line of laser tools, including the flagship NVT 7700 system that integrates laser scribing and advanced metrology capabilities. The company claims these are the only tools in the industry to offer this level of process control and observability, enabling both rapid prototyping and high-volume manufacturing. NVT also introduced the NVT 6600 and NVT 5500 product families, targeting production environments with different requirements.
Why it matters
The new NVT laser tools represent a significant advancement in back-end semiconductor processing technology, providing integrated metrology and singulation capabilities that can improve die break strength, placement accuracy, and overall process control. This is particularly important as the semiconductor industry continues to scale device complexity and pursue advanced packaging techniques.
The details
The flagship NVT 7700 system can process up to 30 wafers per hour with sub-3mm placement accuracy and a gauge repeatability and reproducibility (GR&R) of less than 300nm. It offers independent and simultaneous execution of scribing, dicing, metrology, coating, cleaning, and post-coat baking for both mounted and unmounted wafers. The NVT 6600 family targets production environments where integrated metrology is not required, while the NVT 5500 is a stand-alone metrology and inspection system utilizing a patented phase-based, white light approach. The upcoming NVT 9900 platform will feature a dual laser configuration for high-speed and high-quality full-cut laser scribing and dicing.
- The NVT Advanced Packaging tools are set for release in 2026.
- The NVT 9900 platform is scheduled for release in mid-2026.
The players
Nanoverse Technologies Limited (NVT)
A technology company that has developed advanced laser systems and metrology tools for semiconductor manufacturing.
Jeff Albelo
The CEO of Nanoverse Technologies Limited.
What they’re saying
“We now offer real-time process observability coupled with advanced singulation technology for both rapid prototyping and High-Volume Manufacturing (HVM) alike. It's a game changer.”
— Jeff Albelo, CEO (bakercityherald.com)
What’s next
The NVT 9900 platform, featuring a dual laser configuration for high-speed and high-quality full-cut laser scribing and dicing, is set for release in mid-2026.
The takeaway
Nanoverse Technologies' new Advanced Packaging line of laser tools represents a significant advancement in semiconductor manufacturing, providing integrated metrology and singulation capabilities that can improve die break strength, placement accuracy, and overall process control. This innovation comes at a critical time as the industry continues to scale device complexity and pursue advanced packaging techniques.
