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Clinton Today
By the People, for the People
Indium Corporation Introduces New Solder Paste for Fine-Feature Electronics
Indium12.9HF solder paste designed to improve yields and reliability in advanced component assembly
Apr. 8, 2026 at 6:34am
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Indium Corporation's new Indium12.9HF solder paste aims to enable reliable fine-feature electronics assembly with high yields and long-term reliability.Clinton TodayIndium Corporation, a materials science company based in Clinton, New York, has launched a new no-clean, halogen-free solder paste called Indium12.9HF. The paste is engineered to support fine-feature printing for advanced component sizes like 01005 and 008004 packages, delivering high stencil print transfer efficiency across a wide range of process conditions to improve solder paste inspection (SPI) yields in high-density board designs.
Why it matters
As electronics continue to shrink in size and increase in complexity, solder paste materials that can reliably handle fine features and maintain quality during the assembly process are crucial. Indium12.9HF aims to address these challenges, helping electronics manufacturers improve yields and long-term reliability.
The details
Indium12.9HF is designed to provide low voiding performance on common surface finishes like organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG), improving thermal management and long-term reliability. It also demonstrates high oxidation resistance during reflow, with little to no graping or solder balling on pads as small as 175 microns. The solder paste supports a range of Pb-free solder alloys and powder types, including Type 5-MC as a standard offering.
- Indium Corporation introduced Indium12.9HF in April 2026.
The players
Indium Corporation
A materials science company based in Clinton, New York that develops advanced solder paste and other electronics assembly materials.
The takeaway
Indium12.9HF represents an important advancement in solder paste technology, enabling electronics manufacturers to reliably assemble increasingly miniaturized and complex components while maintaining high yields and long-term product reliability.
