William E. Corbin Recognized as Pinnacle Professional Member of Inner Circle of Excellence

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William E. Corbin, a semiconductor technology and innovation expert with over four decades of experience, has been recognized as a Pinnacle Professional Member of the Inner Circle of Excellence. Corbin founded Corbin Stratech Consulting LLC in 2025, where he serves as the owner and CEO, providing strategic consulting services informed by his extensive industry knowledge and technical expertise. His distinguished career includes notable accomplishments such as developing and implementing the first copper electroplating system at IBM's Advanced Semiconductor Technology Center in 1995, which significantly improved semiconductor performance.

Why it matters

Corbin's recognition as a Pinnacle Professional Member of the Inner Circle of Excellence highlights his significant contributions to the semiconductor industry over the past four decades. His work has led to advancements in microelectronics and he continues to be a thought leader in the field, sharing his knowledge through co-authorship of industry publications and mentoring future innovators.

The details

Corbin began his academic path with an Associate of Science degree in pre-engineering from Delta College, graduating cum laude in 1980. He then earned a Bachelor of Science in mechanical engineering with a focus on industrial engineering and data systems from Michigan Technological University in 1982. His professional development also includes an IBM agile explorer certification in 2016. During his tenure at IBM Corporation, Corbin developed and implemented the first copper electroplating system at the company's Advanced Semiconductor Technology Center in East Fishkill, New York in 1995, a groundbreaking innovation that significantly improved semiconductor performance. Corbin has also contributed to advancing semiconductor knowledge through co-authorship of the case study 'Rethinking the Approach to Higher 450mm Process Gas Flows', which was presented at the IEEE Advanced Semiconductor Manufacturing Conference in Saratoga Springs, New York in 2014.

• Corbin founded Corbin Stratech Consulting LLC in 2025.
• Corbin developed and implemented the first copper electroplating system at IBM's Advanced Semiconductor Technology Center in 1995.
• Corbin co-authored the case study 'Rethinking the Approach to Higher 450mm Process Gas Flows', which was presented at the IEEE Advanced Semiconductor Manufacturing Conference in Saratoga Springs, New York in 2014.
• Corbin earned his IBM agile explorer certification in 2016.

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