Samsung Unveils Faster HBM4 Chips, Challenging SK Hynix

New memory chips deliver 46% faster speeds, aiming to meet surging demand for AI-powered graphics

Published on Feb. 12, 2026

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Samsung Electronics has begun mass production and shipment of its next-generation high-bandwidth memory (HBM4) chips, claiming a significant 46% performance boost over the industry standard. The move challenges longtime rival SK Hynix's dominance in the high-performance memory market, as Samsung seeks to solidify its position as a leader in the tech industry and meet the surging demand for Nvidia's graphics chips used in AI applications.

Why it matters

The battle between Samsung and SK Hynix for market share in the high-bandwidth memory market is intensifying, as both companies vie to supply the critical components needed for the latest AI-powered graphics chips. This competition could lead to further innovation and performance gains that benefit the broader technology industry.

The details

Samsung's new HBM4 chips can deliver a consistent transfer speed of 11.7 gigabits per second (Gbps), roughly 46% faster than the JEDEC industry standard of 8 Gbps, and can be pushed to 13 Gbps under optimized conditions. This performance boost aims to meet the high demand for Nvidia's graphics chips, which are widely used in AI model training and operationalization. Samsung has been working to narrow the gap with SK Hynix, which has previously captured the majority of Nvidia's high-bandwidth memory orders.

  • Samsung began mass production and shipment of its HBM4 chips on February 12, 2026.

The players

Samsung Electronics

A multinational electronics company and one of the largest tech firms in South Korea, known for its consumer electronics, semiconductors, and other technology products.

SK Hynix

A South Korean semiconductor company and a major competitor to Samsung in the memory chip market, particularly in the high-bandwidth memory segment.

Nvidia Corp.

An American technology company known for its graphics processing units (GPUs), which are widely used in AI applications and have seen surging demand.

Jaihyuk Song

The Corporate President and Chief Technology Officer (CTO) of Samsung Electronics' Device Solutions Business.

Wonjin Lee

The president and head of global marketing at Samsung.

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What they’re saying

“We're showing Samsung's true abilities once more. Although we haven't fully showcased how Samsung meets customer needs with top-notch technology for a while, you can see this as our return to form.”

— Jaihyuk Song, Corporate President and Chief Technology Officer (CTO), Samsung Electronics' Device Solutions Business (Semicon Korea conference)

“There will be challenges with semiconductor supplies, and everyone will feel the impact. Prices are increasing right now. We definitely don't want to pass that cost onto consumers, but we may reach a point where we have to rethink our product pricing.”

— Wonjin Lee, President and Head of Global Marketing, Samsung (CES in Las Vegas)

What’s next

Samsung is expected to continue ramping up production and shipment of its HBM4 chips to meet the growing demand for high-performance memory in the AI and graphics industries.

The takeaway

The intensifying competition between Samsung and SK Hynix in the high-bandwidth memory market is driving innovation and performance gains that could benefit the broader technology industry, as companies race to supply the critical components needed for the latest AI-powered graphics chips.