Molex Launches Impress Co-Packaged Copper Solutions for Next-Gen Data Rates

New compression-based connector and cable assembly supports up to 224Gbps PAM-4 for AI and data center applications.

Published on Feb. 24, 2026

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Molex, a global electronics leader, has launched its Impress Co-Packaged Copper Solutions to meet the needs of next-generation data centers and AI workflows by delivering ultra-high-speed data transmission and exceptional signal integrity. The Impress solution provides a compression-based, substrate connector and mating cable assembly that supports data rates up to 224Gbps PAM-4 and beyond.

Why it matters

As AI workloads push data centers to their physical limits, Molex is focused on maximizing efficiency without sacrificing signal integrity. Impress is designed to help scale infrastructures without exponential increases in power consumption or cost, enabling high performance at the rack level and making next-generation compute more technically and economically viable.

The details

Impress extends Molex's success with NearStack On-the-Substrate (OTS) Connectors, which paved the way for scalable, next-generation systems with a direct-to-chip solution that moved high-speed paths off the board. Impress Co-Packaged Copper represents the next leap in architectural evolution by placing the connection point directly onto the ASIC package substrate, reducing signal loss and crosstalk.

  • Molex Impress Co-Packaged Copper Solutions are available now for applications requiring data rates up to 224Gbps PAM-4.
  • Development work is underway to validate Impress Co-Packaged Copper Solutions for use with 336G and 448G applications.

The players

Molex

A global electronics leader and connectivity innovator.

Jairo Guerrero

VP & GM, Copper Solutions, Molex.

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What they’re saying

“As AI workloads push data centers to their physical limits, we are focused on maximizing efficiency without sacrificing signal integrity. Impress is our latest innovation built to help scale infrastructures without exponential increases in power consumption or cost. By enabling high performance at the rack level, Molex is making next-generation compute more technically and economically viable.”

— Jairo Guerrero, VP & GM, Copper Solutions, Molex

What’s next

Development work is underway to validate Impress Co-Packaged Copper Solutions for use with 336G and 448G applications.

The takeaway

Molex's Impress Co-Packaged Copper Solutions represent the next leap in architectural evolution, placing the connection point directly onto the ASIC package substrate to reduce signal loss and crosstalk, enabling future-proof AI and data center architectures.