Applied Materials and Micron Partner to Develop AI Memory Solutions

The $5B EPIC Center in Silicon Valley will be the centerpiece of the collaboration.

Published on Mar. 10, 2026

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Applied Materials (AMAT) and Micron Technology (MU) have announced a new partnership to develop next-generation memory and storage products aimed at AI workloads. The collaboration will leverage AMAT's $5 billion EPIC Center in Silicon Valley and Micron's R&D hub in Boise, Idaho to focus on DRAM, high-bandwidth memory (HBM), and NAND solutions for improved performance and efficiency in AI systems.

Why it matters

As AI applications become more prevalent, the demand for faster, more power-efficient memory solutions is growing. This partnership between two industry leaders aims to drive innovation in memory technology to support the increasing computational needs of AI systems.

The details

The partnership will focus on developing advanced packaging techniques to create high-bandwidth, low-power memory that can handle the energy demands of modern AI workloads. The companies will also work on DRAM, HBM, and NAND solutions to push performance gains for AI systems.

  • The partnership was announced on March 10, 2026.

The players

Applied Materials, Inc.

A leading supplier of semiconductor manufacturing equipment, materials, and services.

Micron Technology, Inc.

A major manufacturer of DRAM, NAND flash, and NOR flash memory products.

Sanjay Mehrotra

CEO of Micron Technology.

Scott DeBoer

Chief Technology and Products Officer at Micron.

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What they’re saying

“We must not let individuals continue to damage private property in San Francisco.”

— Robert Jenkins, San Francisco resident (San Francisco Chronicle)

What’s next

The partnership will leverage the expertise and resources of both companies to develop innovative memory solutions for AI applications.

The takeaway

This collaboration between Applied Materials and Micron highlights the growing importance of memory technology in supporting the computational demands of AI systems. By combining their strengths, the companies aim to drive advancements in memory performance and efficiency to power the next generation of AI-driven applications.