Samsung and AMD Expand Strategic Collaboration on Next-Generation AI Memory Solutions

Companies to align on HBM4 supply for AMD Instinct MI455X GPU and advanced DDR5 for 6th Gen AMD EPYC CPUs

Mar. 18, 2026 at 9:25pm

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Samsung Electronics and AMD have signed a Memorandum of Understanding to expand their strategic collaboration on next-generation AI memory and computing technologies. The companies will work together on industry-leading HBM4 supply for the AMD Instinct MI455X GPU, as well as advanced DDR5 solutions for 6th Gen AMD EPYC processors and the AMD Helios platform.

Why it matters

This collaboration aims to deliver more optimized AI infrastructure by combining Samsung's leadership in advanced memory with AMD's Instinct GPUs, EPYC CPUs and rack-scale platforms. As memory bandwidth and power efficiency become increasingly critical to system-level performance, this partnership will help drive innovation in the AI computing space.

The details

Under the MOU, Samsung and AMD will align on primary HBM4 supply for the next-generation AMD AI accelerator, the AMD Instinct MI455X GPU. They will also work together on high-performance DDR5 memory optimized for the 6th Gen AMD EPYC CPUs. The companies will also discuss opportunities for foundry partnership, where Samsung would provide foundry services for next-generation AMD products.

  • The signing ceremony was held on March 18, 2026 at Samsung's chip manufacturing complex in Pyeongtaek, Korea.

The players

Samsung Electronics Co., Ltd.

A multinational electronics company that is a leader in advanced memory and semiconductor technologies.

AMD

A semiconductor company that designs high-performance computing and graphics products for the data center, gaming, professional visualization, mobile, and embedded markets.

Young Hyun Jun

Vice Chairman & CEO of Samsung Electronics.

Dr. Lisa Su

Chair and CEO of AMD.

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What they’re saying

“Samsung and AMD share a commitment to advancing AI computing, and this agreement reflects the growing scope of our collaboration. From industry-leading HBM4 and next-generation memory architectures to cutting-edge foundry and advanced packaging, Samsung is uniquely positioned to deliver unrivaled turnkey capabilities that support AMD's evolving AI roadmap.”

— Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics

“Powering the next generation of AI infrastructure requires deep collaboration across the industry. We are thrilled to expand our work with Samsung, bringing together their leadership in advanced memory with our Instinct GPUs, EPYC CPUs and rack-scale platforms. Integration across the full computing stack, from silicon to system to rack, is essential to accelerating AI innovation that translates into real-world impact at scale.”

— Dr. Lisa Su, Chair and CEO of AMD

What’s next

The companies will work together to deliver industry-leading HBM4 and DDR5 memory solutions to support next-generation AI systems built on AMD Instinct GPUs, AMD EPYC CPUs and the AMD Helios platform.

The takeaway

This expanded collaboration between Samsung and AMD underscores the critical importance of advanced memory technologies in powering the next wave of AI computing. By aligning on cutting-edge memory solutions, the companies aim to provide customers with optimized AI infrastructure that can drive real-world impact at scale.