Empower Semiconductor Launches High-Density Embedded Silicon Capacitors for AI and HPC

New ECAP portfolio aims to unlock power integrity for next-gen processor performance

Published on Feb. 10, 2026

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Empower Semiconductor, a leader in powering AI processors, has announced the launch of three new embedded silicon capacitors (ECAPs) designed to meet the power integrity demands of next-generation AI and high-performance computing (HPC) processors. The new ECAP portfolio includes the EC2005P, EC2025P, and EC2006P, offering increased capacitance in smaller form factors to enable higher performance and efficiency in AI and HPC applications.

Why it matters

As AI processors push the limits of performance, power delivery has emerged as a critical constraint. Embedding high-density silicon capacitors directly into the processor substrate is now essential to achieve the required power integrity for extreme current densities and ultrafast transient response, unlocking the performance scaling needed for next-generation AI and HPC.

The details

Empower's new ECAP solutions feature ultralow equivalent series inductance (ESL) and equivalent series resistance (ESR), delivering optimal power delivery network (PDN) performance and improved power integrity. Each device has been engineered to meet the strict dimensional and tolerance requirements for embedded deployment within AI and HPC processors.

  • Empower Semiconductor will present the new ECAP portfolio and power delivery optimization strategies at the Chiplet Summit on February 17-19, 2026 and DesignCon on February 24-26, 2026.

The players

Empower Semiconductor

A Silicon Valley-based company that powers the AI revolution with its FinFast technology, delivering on-demand scalable power with the speed, precision and signal integrity required by AI processors.

Steve Hertog

Senior Vice President Worldwide Sales at Empower Semiconductor.

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What they’re saying

“Our customers are under intense pressure to deliver greater performance with tighter power margins. These new ECAPs are a proven and practical way to deploy higher capacitance density into a smaller footprint right at the package level of the AI processor.”

— Steve Hertog, Senior Vice President Worldwide Sales (Empower Semiconductor)

What’s next

Empower Semiconductor's new EC2005P, EC2025P, and EC2006P ECAPs are available in mass production now, supporting the next wave of AI and HPC platform development.

The takeaway

Empower Semiconductor's new high-density embedded silicon capacitors are a critical enabler for unlocking the power integrity needed to scale next-generation AI and HPC processor performance, addressing a key challenge facing the industry as it pushes the limits of AI processing power.