EPIC Microsystems Raises $21 Million in Oversubscribed Series A

The semiconductor company's power delivery tech aims to address AI infrastructure's growing power demands.

Mar. 30, 2026 at 3:38pm

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A photorealistic studio still-life image featuring a sleek, metallic power module component with clean geometric shapes and sharp shadows, conceptually representing the advanced power delivery technology developed by EPIC Microsystems.EPIC Microsystems' innovative power delivery solutions aim to address the growing power demands of AI infrastructure.San Jose Today

EPIC Microsystems, a semiconductor company developing power delivery solutions for AI infrastructure, has raised $21 million in an oversubscribed Series A funding round led by Seligman Ventures. The funding will accelerate the development and commercialization of EPIC's vertical power delivery technology for next-generation AI compute platforms.

Why it matters

As AI workloads drive data center power demands to unprecedented levels, traditional power delivery solutions are facing scaling challenges in efficiency, thermal management and physical integration. EPIC's technology aims to address these issues and give hyperscalers greater flexibility as rack power scales toward the multi-megawatt era.

The details

EPIC's hybrid switched-capacitor architecture delivers improved power efficiency, current density and thermal performance compared to legacy power delivery solutions. The compact, low-profile design is optimized to support AI accelerators and GPUs, reducing heat dissipation and enabling more effective system-level thermal management.

  • EPIC Microsystems has raised a total of $26 million to date.
  • The Series A funding round was completed on March 30, 2026.

The players

EPIC Microsystems

A semiconductor company developing breakthrough power delivery solutions for AI infrastructure.

Seligman Ventures

The lead investor in EPIC Microsystems' Series A funding round.

Umesh Padval

The managing partner at Seligman Ventures who will join EPIC Microsystems' Board of Directors.

Sabin Eftimie

The co-founder and CEO of EPIC Microsystems.

Lip-Bu Tan

The CEO of Intel and a seed investor in EPIC Microsystems.

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What they’re saying

“Power density, efficiency and thermal management have become primary bottlenecks in scaling AI data center infrastructure. EPIC's technical team brings deep expertise in switched-capacitor innovation and a clear understanding of data center requirements. We believe their vertical power delivery architecture is well positioned to address the next generation of AI system demands.”

— Umesh Padval, Managing Partner, Seligman Ventures

“AI data center architectures are breaking historic power boundaries, and existing power delivery ecosystems simply can't keep up. Our approach reimagines DC-DC power delivery from the ground up. By addressing efficiency, thermals, and rack densification simultaneously, we give hyperscalers greater architectural flexibility as rack power scales toward the multi-megawatt era.”

— Sabin Eftimie, Co-founder and CEO, EPIC Microsystems

“The AI compute roadmap is being defined as much by power delivery innovation as by advances in AI compute silicon.”

— Lip-Bu Tan, CEO, Intel

What’s next

With this funding, EPIC Microsystems plans to accelerate the development and commercialization of its vertical power delivery technology for next-generation AI compute platforms.

The takeaway

EPIC Microsystems' innovative power delivery solutions aim to address the growing power demands of AI infrastructure, providing hyperscalers with greater flexibility and efficiency as data center power requirements continue to scale.