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Micron Begins High-Volume Production of HBM4 for NVIDIA Vera Rubin, PCIe Gen6 SSD, and SOCAMM2
New memory and storage products deliver unprecedented bandwidth, capacity, and power efficiency for AI and HPC workloads
Mar. 16, 2026 at 9:48pm
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Micron Technology has announced the start of high-volume production for several new memory and storage products designed to power the next generation of AI and high-performance computing. This includes the HBM4 36GB 12H memory chip with over 2.8 TB/s of bandwidth and 20% better power efficiency compared to the previous HBM3E, the industry's first PCIe Gen6 SSD delivering up to 2x the read performance of Gen5 at 100% higher performance per watt, and the 192GB SOCAMM2 memory module expanding low-power, high-capacity options for the NVIDIA Vera Rubin platform.
Why it matters
These new Micron products are critical components that will enable significant performance and efficiency improvements for AI, HPC, and other data-intensive workloads. The HBM4 memory, PCIe Gen6 SSD, and SOCAMM2 modules are designed to work seamlessly with NVIDIA's latest Vera Rubin and BlueField-4 platforms, providing a tightly integrated hardware foundation to unlock the full potential of next-generation AI and computing applications.
The details
Micron's HBM4 36GB 12H memory chip achieves over 11 Gb/s pin speeds, enabling a bandwidth greater than 2.8 TB/s - a 2.3x improvement over HBM3E. The company has also demonstrated advanced packaging capability with a 48GB 16H HBM4 sample, providing a 33% increase in capacity per HBM placement. The Micron 9650 PCIe Gen6 SSD delivers up to 2x the read performance of Gen5 SSDs at 100% higher performance per watt, optimized for AI workloads on NVIDIA's BlueField-4 architecture. The 192GB SOCAMM2 module expands low-power, high-capacity memory options for the Vera Rubin platform, part of Micron's broader SOCAMM2 portfolio spanning 48GB to 256GB.
- Micron began high-volume shipment of the HBM4 36GB 12H in Q1 2026.
- Micron announced mass production of the Micron 9650 PCIe Gen6 SSD on February 12, 2026.
The players
Micron Technology, Inc.
An industry leader in innovative memory and storage solutions, transforming how the world uses information to enrich life for all.
NVIDIA
A technology company that designs graphics processing units (GPUs) for the gaming and professional markets, as well as system on a chip units (SoCs) for the mobile computing and automotive market.
What they’re saying
“The next era of AI will be defined by tightly integrated platforms developed through joint engineering innovations across the ecosystem. Our close collaboration with NVIDIA ensures that compute and memory are designed to scale together from day one.”
— Sumit Sadana, Executive Vice President and Chief Business Officer at Micron Technology
What’s next
Micron will showcase its advanced memory and storage portfolio enabling end-to-end AI acceleration from the data center to the edge at the NVIDIA GTC 2026 conference.
The takeaway
Micron's new HBM4, PCIe Gen6 SSD, and SOCAMM2 products represent critical infrastructure for powering the next generation of AI and high-performance computing, providing unprecedented bandwidth, capacity, and energy efficiency through tight integration with NVIDIA's latest platforms.
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