StratEdge Showcases Gold Plated Tabs and Molded Ceramic Packaging at CMSE 2026

StratEdge to highlight advanced packaging solutions for high-power RF devices at the industry conference in Los Angeles.

Apr. 7, 2026 at 9:55am

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An extreme close-up of a gold-plated semiconductor tab with a smooth, reflective surface against a plain white background, conveying the precision engineering and high-quality materials of StratEdge's packaging solutions.StratEdge's gold-plated tabs enable advanced die-on-tab assembly for high-power RF devices.Los Angeles Today

StratEdge Corporation, a leader in high-frequency, high-power, and high-reliability semiconductor packaging, will exhibit at the CMSE 2026 conference in Los Angeles from April 28-30. At Booth B10, the company will showcase its gold plated tab product line that supports advanced die-on-tab assembly for gallium nitride (GaN) and other high-power devices, as well as its molded ceramic package options for RF and microwave applications up to 18 GHz.

Why it matters

StratEdge's packaging solutions enable engineers to balance critical factors like thermal performance, manufacturability, and long-term reliability when developing high-power RF devices for demanding applications in industries like defense, aerospace, and telecommunications. As a leader in the field, StratEdge's participation at CMSE 2026 highlights the company's expertise and the importance of advanced packaging in supporting the growth of high-frequency, high-power semiconductor technologies.

The details

StratEdge's gold plated tabs support eutectic die attachment of GaN and other high-frequency, high-power devices using gold-tin (AuSn) and gold-silicon (AuSi) bonding. For chip-on-board applications, the chip is attached to the thermally conductive tab before the tab is installed onto the board, an approach well-suited for organic boards that cannot withstand eutectic die attach temperatures. This helps ensure the critical first-level interface between the chip and system is optimized for maximum device performance. The company will also showcase its molded ceramic package options for RF and microwave applications up to 18 GHz, with more than 200 standard outlines available to provide designers with a broad range of high-reliability packaging choices for harsh-environment applications.

  • CMSE 2026 will take place from April 28-30, 2026 in Los Angeles, California.

The players

StratEdge Corporation

A leader in the design, production, and assembly of high-frequency, high-power, and high-reliability semiconductor packages.

Casey Krawiec

Vice President of Sales at StratEdge.

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What they’re saying

“Our gold plated tabs support advanced die-on-tab assembly for GaN and other high-power devices, and we look forward to discussing packaging approaches that help customers balance thermal performance, manufacturability, and long-term reliability.”

— Casey Krawiec, VP of Sales

What’s next

Visitors to StratEdge's booth at CMSE 2026 can learn more about the company's packaging and assembly capabilities, as well as download a white paper on die-on-tab assembly for compound semiconductors.

The takeaway

StratEdge's participation at CMSE 2026 highlights the critical role that advanced semiconductor packaging plays in enabling the performance and reliability of high-power RF devices used in demanding applications across industries like defense, aerospace, and telecommunications.