THine Electronics Unveils Optical Chipset for Next-Gen AI Networks

New DSP-free technology aims to reduce power, latency, and cost for high-speed interconnects.

Feb. 1, 2026 at 10:31pm

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THine Electronics, Inc. has announced the development of an optical DSP-free chipset featuring its ZERO EYE SKEW® technology. The new chipset is designed for short-reach optical interconnects in PCI Express 7 (PCIe7) 2TB/s linear pluggable optics (LPO) or co-packaged optics (CPO) applications, promising to save 73% in power and reduce latency by 90%. THine plans to deliver samples of the VCSEL driver, transport amplifier, and "Sideband Aggregator" IC in 2026 and 2027 to support the next generation of scale-up AI networks.

Why it matters

THine's new optical chipset technology aims to enable more cost-effective, lower latency, and power-efficient short-reach optical interconnects for the growing demands of scale-up AI networks. By eliminating the need for optical DSP, the company believes it can provide a simpler and more efficient solution for high-speed data transmission in next-gen computing infrastructure.

The details

THine's optical DSP-free chipset utilizes its proprietary ZERO EYE SKEW® technology to enable short-reach optical interconnects for PCIe6 and PCIe7 applications. The company also developed a "Sideband Aggregator" IC to reduce the number of GPIO lines required for these interconnects by up to 50%. THine plans to showcase its new solutions at the 2026 Optical Fiber Communications Conference and Exhibition (OFC2026) in Los Angeles.

  • THine will deliver samples of the VCSEL driver and transport amplifier (TIA) for PCIe7 in 2027.
  • THine will deliver samples of the VCSEL driver and TIA for PCIe6, as well as its "Sideband Aggregator" IC samples, in 2026.

The players

THine Electronics, Inc.

A Japanese electronics company that develops optical interconnect technologies.

National Institute of Information and Communications Technology (NICT)

A Japanese government agency that provided grant funding to support the development of THine's optical DSP-free chipset technology.

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What’s next

THine plans to showcase its new optical DSP-free chipset solutions at the 2026 Optical Fiber Communications Conference and Exhibition (OFC2026) in Los Angeles.

The takeaway

THine's new optical chipset technology aims to address the growing demand for more power-efficient, low-latency, and cost-effective high-speed interconnects in the next generation of scale-up AI networks, potentially enabling simpler and more streamlined optical data transmission solutions.