New Metallic Material Conducts Heat 3x Faster Than Copper

Researchers at UCLA discover theta-phase tantalum nitride with record-breaking thermal conductivity.

Jan. 27, 2026 at 11:07am

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Aerospace engineers at the University of California Los Angeles (UCLA) have discovered a new metallic material called theta-phase tantalum nitride that exhibits an ultrahigh thermal conductivity of 1,100 W/mK - nearly three times higher than copper, the current industry standard. This breakthrough could lead to more efficient heat dissipation in data centers, smartphones, computers, and other high-performance electronics.

Why it matters

As technology continues to advance, particularly in areas like AI and quantum computing, the demand for efficient heat dissipation is becoming a critical concern. Conventional metals like copper are reaching their performance limits, making this new metallic material a potentially game-changing alternative for heat sinks and other thermal management applications.

The details

Using advanced analysis techniques, the UCLA researchers found that theta-phase tantalum nitride has unusually weak electron-phonon interactions, allowing for super-efficient heat flow through the material with much less resistance compared to copper and silver. This unique crystal structure and atomic arrangement is what gives the material its record-breaking thermal conductivity.

  • The research findings were published in the journal Science in January 2026.

The players

Yongjie Hu

A professor at the UCLA Samueli School of Engineering who led the study on the new metallic material.

University of California Los Angeles (UCLA)

The university where the aerospace engineering research team that discovered the high thermal conductivity of theta-phase tantalum nitride is based.

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What they’re saying

“As AI technologies advance rapidly, heat-dissipation demands are pushing conventional metals like copper to their performance limits, and the heavy global reliance on copper in chips and AI accelerators is becoming a critical concern.”

— Yongjie Hu, Professor, UCLA Samueli School of Engineering (Science)

What’s next

The researchers plan to further study the properties and potential applications of theta-phase tantalum nitride, with the goal of developing new heat management solutions for high-performance electronics, aerospace systems, and quantum computers.

The takeaway

This discovery of a metallic material with record-breaking thermal conductivity could be a game-changer for the electronics industry, providing a much-needed solution to the growing challenge of heat dissipation in powerful, next-generation devices.