StratEdge Showcases Molded Ceramic Packages at Upcoming Conferences

The company will highlight its die-on-tab and molded ceramic package offerings at IMAPS Device Packaging and GOMACTech events.

Published on Feb. 27, 2026

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StratEdge Corporation, a leader in high-frequency, high-power, and high-reliability semiconductor packaging, will showcase its molded ceramic and gold-plated tab products at two upcoming industry conferences in March 2026 - the IMAPS Device Packaging Conference in Phoenix, Arizona, and the GOMACTech exhibition in New Orleans, Louisiana.

Why it matters

StratEdge's packaging solutions, including molded ceramic packages and die-on-tab designs, are crucial for enabling advanced RF power systems that require high performance, reliability, and manufacturability. The company's participation in these conferences allows it to connect with engineers and designers working on cutting-edge compound semiconductor applications across industries like telecom, defense, and aerospace.

The details

At the conferences, StratEdge will highlight its gold-plated tab products that support eutectic die attachment of gallium nitride (GaN) and other high-frequency, high-power devices. The company will also showcase its molded ceramic package options, including the MC Series configurations for RF and microwave applications up to 18 GHz. Molded ceramic packages provide a wide array of options for applications requiring MIL-STD reliability, such as defense aerospace and harsh environments.

  • The IMAPS Device Packaging Conference will take place on March 3-4, 2026 in Phoenix, Arizona.
  • The GOMACTech exhibition will be held on March 10-11, 2026 in New Orleans, Louisiana.

The players

StratEdge Corporation

A leader in the design, production, and assembly of high-frequency, high-power, and high-reliability semiconductor packages.

Casey Krawiec

The Vice President of Sales at StratEdge.

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What they’re saying

“Our team is ready to help engineers evaluate die-on-tab workflows and packaging options that balance power, reliability, and manufacturability.”

— Casey Krawiec, VP of Sales (Business Wire)

What’s next

StratEdge invites attendees to visit their booths at the IMAPS Device Packaging Conference and GOMACTech exhibition to learn more about their packaging solutions and die-on-tab capabilities.

The takeaway

StratEdge's participation in these industry events demonstrates its commitment to providing innovative packaging solutions that enable the development of advanced RF power systems across a range of high-performance, high-reliability applications.